- 封测服务
- package test service
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封装系列 Package |
封装厚度 (Max.) |
表面处理 |
应用领域 |
|
QFN/DFN/COL |
W: 0.8mm UT: 0.6mm X1: 0.5mm X2:0.4mm X3:0.33mm |
NiPdAu/100% Sn |
电子/通讯/汽车/智能家具/工业控制等 |
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LGA/FLGA |
0.35~1.85mm |
NiPdAu/NiAu |
射频/加速度计/硅麦/压力/磁/温度/光学传感器 |
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CSP |
0.5mm;0.6mm |
NiPdAu/NiAu |
滤波器/音频 |
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SiP |
0.8mm;0.95mm;1.1mm |
NiPdAu/NiAu/ 100% Sn |
电源管理/电流传感器 |
|
SOP |
2.3 /1.35 mm |
100% Sn |
隔离/电流 |
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